Optimization Design of System Cable Layout in High Heat Dissipation Integrated Environment

To address the issue of insulation melting failure due to thermal accumulation in high-power RF cables used in high-heat-consumption integrated environments, a technical null-point approach was employed for failure analysis and layout optimization. A mathematical model of cable heat dissipation was first developed; simulation results and experimental measurements confirmed that dense bundling of multiple cables was the primary cause of excessive temperature rise. Subsequently, a multi-objective layout strategy targeting temperature rise, insertion loss, and cable length was proposed. Through implementation of measures such as layered staggering, the maximum cable temperature was significantly reduced, meeting the performance degradation requirements with an error below 3%. This achievement provides valuable insights for cable layout design in high-density integrated systems.