Abstract: Aiming at the life evaluation problem of IGBT module, the core component of CRH380D EMU converter, taking the five-level repair module and the new product of the same model that have been running for 10 years as the research object, the high temperature and high pressure reverse deflection (HTRB) and power cycle accelerated aging test are carried out to explore the degradation law of its life characteristic parameters. At the end of the 1000-hour HTRB test, none of the samples failed and there was no obvious trend of parameter degradation, indicating that high temperature and high voltage environment is not the weak link of IGBT reliability. In the power cycle test, the module mainly fails due to the aging of the solder layer between the chip and the DCB layer and the solder layer between the DCB layer and the bottom plate, which is manifested as the increase of the thermal resistance of the crust and the sharp increase of the collector cut-off current (ICES). Based on the Coffin-Manson life model evaluation, the remaining life of the five levels of repair modules is more than 10 years. The research provides experimental basis and data support for the operation and maintenance strategy formulation and life prediction of EMU IGBT module.