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基于40.5kV母线桥绝缘性能故障分析与改进

Fault Analysis and Improvement of Insulation Performance for 40.5 kV Bus Bridge

  • 摘要: 本文介绍一起40.5kV相间距300mm母线桥绝缘性能故障案例,分析发现,污秽附着在绝缘件表面,同时柜内湿度高是加速绝缘性能失效的主要原因,并结合Ansys有限元仿真进行分析与对比洁净状态下与湿污状态下绝缘子电场强度的变化,进一步佐证湿污工况下,易诱发绝缘性能故障,最后提出现场运维防污秽策略及改进方案,为现场防污运维及绝缘故障防控提供理论与实践依据。

     

    Abstract: This paper presents a case study on insulation failure of a 40.5 kV bus bridge with a phase-to-phase spacing of 300 mm. Analysis reveals that contamination adhering to the surface of insulating components, combined with high humidity inside the switchgear, are the primary factors accelerating insulation degradation. By using Ansys finite element simulation, the electric field distribution of insulators under clean and contaminated wet conditions is analyzed and compared, further confirming that wet contamination significantly increases the risk of insulation failure. Finally, practical anti-contamination operation strategies and improvement measures are proposed, providing theoretical and practical guidance for field maintenance and insulation fault prevention.

     

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